Industry Application

Semiconductor & Wafer Processing
Direct Drive Applications

Semiconductor & Wafer Processing — Direct Drive Applications

Semiconductor processing demands a rigorous balance between nanometer-level positioning accuracy, high throughput and a clean environment. Ironless and iron-core linear motors drive wafer positioning, AOI and placement axes contactlessly, with zero backlash and high dynamics; Z-axis short-stroke actuators enable fast Pick & Place and probe testing.

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Requirements

Drive Challenges in Semiconductor ProcessingDrive challenges in semiconductor processing

Wafer positioning, inspection and placement demand the highest levels of accuracy, dynamics, cleanliness and motion smoothness.

High Dynamics & Short Cycle TimeHigh Dynamics & Short Cycle Time

Top speed up to 30.4 m/s (UPLplus)

Wafer handling and placement strive for maximum throughput. UPLplus ironless linear motors improve the force-to-mass ratio by up to 42%, reducing moving mass and cycle time for high-dynamic positioning operations.

Precise Positioning, No OvershootPrecise Positioning, No Overshoot

No cogging · zero backlash

Ironless motors have no cogging force or ripple force and move extremely smoothly; the iron-core L1 series positions precisely with no overshoot. Direct drive eliminates drive-train backlash, so positioning accuracy depends on the measuring system rather than mechanical transmission.

Clean & Particle-FreeClean & Particle-Free

Contactless · wear-free

Semiconductor cleanrooms require freedom from particle contamination. Direct-drive motors have contactless transmission and are wear-free, and can be paired with air bearings; the LRAM Z-axis uses frictionless air bearings, ideal for particle-sensitive process environments.

Compact & Low Moving MassCompact & Low Moving Mass

UPLplus thickness 21 mm

Multi-axis wafer stages are space-constrained. The UPLplus primary part weighs only 64 – 552 g, the L1A has an installation height of only 31 mm, and Z-axis actuators have a moving mass as low as 10 g (LRAM), benefiting miniaturization and high dynamics.

Solutions

Direct Drive Solutions for SemiconductorDirect drive solutions for semiconductor

Linear motors drive horizontal positioning axes, Z-axis subsystems serve as vertical pick-and-place axes, and slotless iron-core torque motors handle rotary positioning.

UPLplus

Ironless Linear MotorIronless Linear Motor

Ironless linear motor built with printed-circuit technology, improving the force-to-mass ratio by up to 42%. With no cogging force, low moving mass and short cycle times, it is ideal for semiconductor placement, Pick & Place, Z-axis drives and metrology & inspection machines.

  • Peak force 100 – 1,300 N, rated force 30 – 300 N
  • Sizes 30 / 60 / 80 mm, top speed up to 30.4 m/s
  • No cogging (ironless design), extremely smooth motion
  • Primary part mass 64 – 552 g
Product Tech Docs
L1

Iron-Core Linear MotorIron-Core Linear Motor

Three-phase slotted permanent-magnet excited AC synchronous linear motor optimized for ultimate efficiency, providing maximum force in limited space. The OEM website explicitly lists applications in semiconductor processing (PCB, wafer positioning, AOI) and production-line placement systems.

  • Peak force 169 – 5,171 N
  • L1A installation height of only 31 mm, excellent force-to-mass ratio
  • Precise positioning with no overshoot, excellent constant velocity
  • Maintenance-free, zero backlash, optional active cooling (L1C)
Product Tech Docs
LDDS-032 · LRAM

Z-Axis Short Stroke ActuatorsZ-Axis Short Stroke Actuators

The LDDS-032 slotted linear-motor Z-axis is used for Pick & Place and fast cycling; the LRAM air-bearing hybrid stepper Z-axis reaches 1,000 m/s² acceleration with a moving mass of only 10 g, ideal for probe testing and lightweight part handling.

  • LDDS-032 peak force 640 N, stroke ±5.5 mm
  • LRAM acceleration up to 1,000 m/s², frictionless air bearings
  • LRAM moving mass of only 10 g, magnetoresistive measuring system
  • Applications: Pick & Place, probe testing
Product Tech Docs
RMK · RMF

Slotless Iron-Core Torque MotorSlotless Torque Motor

Slotless iron-core permanent-magnet AC synchronous motor with low attractive force and exceptionally even motion, ideal for medium-torque rotary positioning with almost no external force in the direction of motion (such as wafer rotation and alignment). Highly flexible in design and diameter, available in flat or coaxial configurations.

  • Diameter 70 – 2,500 mm, torque 2 – 15,000 Nm
  • No cogging, exceptionally even motion, optimal synchronism
  • Flat or coaxial design, for high-precision applications
Product
Application Cases

Typical Applications in Semiconductor ProcessingTypical applications in semiconductor processing

Wafer positioning, AOI and placement correspond to the semiconductor applications listed on the Schaeffler linear-motor website; wafer inspection, direct-write lithography, wafer dicing/scribing, probe testing, laser annealing and die bonding are direct-drive motion needs of comparable industry processes. The common thread of semiconductor processing is "nanometer accuracy × maximum throughput × 24/7 continuous operation × cleanliness (some requiring vacuum)" — direct-drive motors satisfy all four simultaneously with cogging-free, zero-backlash, contactless wear-free motion.

Wafer positioning and placement
Wafer Positioning
Wafer Positioning, Inspection & Lithography
Wafer inspection requires high-speed scanning in the XY plane with real-time Z-axis focusing to detect micro-defects in advanced processes (such as 3 nm-class nodes); direct-write (maskless) lithography requires high-speed XY beam positioning. UPLplus ironless linear motors are explicitly listed for semiconductor placement and Pick & Place, and L1 is listed for semiconductor processing (PCB, wafer positioning, AOI). The cogging-free, zero-backlash high-dynamic motion balances maximum throughput with repeat positioning accuracy, and smooth ripple-free motion avoids periodic errors during scanning.
UPLplus L1
Die bonding and fast pick-and-place
Die Bonding
Die Bonding, Packaging & Wafer Dicing
IC and wafer packaging require multi-axis placement and alignment to improve yield, while wafer dicing/scribing requires synchronizing XY motion with cutting and maintaining throughput without damaging sensitive structures. Comparable industry equipment uses Z-axis short-stroke actuators as press-down axes: LDDS-032 (peak force 640 N) for Pick & Place and fast cycling, paired with UPLplus horizontal positioning axes to form a high-dynamic pick-and-place module, with zero backlash ensuring placement alignment repeatability.
Z-Axis Subsystem UPLplus
Probe testing and wafer inspection
Wafer Probing
Probe Testing, Laser Annealing & Final Test
Wafer probe testing requires contact positioning with very low moving mass and high acceleration, while also maintaining structural stiffness to ensure probe alignment; laser annealing requires uniform, smooth scanning motion for consistent heat treatment. The LRAM air-bearing hybrid stepper Z-axis reaches 1,000 m/s² acceleration with a moving mass of only 10 g on frictionless air bearings, and its OEM applications include probe testing and lightweight part handling, and it is also suitable for fast contact positioning in final test.
LRAM Z-Axis Subsystem
Related Pages

Explore Related ApplicationsExplore related applications

Electronics Assembly & PCB Optical Inspection & Metrology Laser Processing

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